TSSOP-48 (Thin Shrink Small Outline Package with 48 pins) is an integrated circuit packaging form of Surface Mount Technology (SMT). The TSSOP package is a variant of SSOP (Shrink Small Outline Package), which has a thinner profile but retains the miniaturization and multi pin characteristics of SSOP.

characteristic:

Thin profile: TSSOP packaging has a thinner profile, suitable for applications with height limitations.

Miniaturization: The miniaturization design of TSSOP-48 packaging saves valuable circuit board space, making it suitable for portable and space limited applications.

Multiple pin count: The TSSOP-48 package has 48 pins, making it suitable for integrated circuits that require a large number of input/output (I/O) pins.

Good electrical performance: Due to the close pin spacing, TSSOP packaging has low parasitic inductance and capacitance, making it suitable for high-speed digital and radio frequency (RF) circuits.

Easy to automate assembly: TSSOP packaging is suitable for high-speed surface mount technology and facilitates automated production lines.

Structure:

The structure of the TSSOP-48 package includes a rectangular or square plastic shell surrounded by straight pins protruding outward. The pitch between pins is usually 0.5mm or 0.65mm, which determines the density of the package and the difficulty of soldering.

Size:

The size of TSSOP-48 packaging may vary depending on the specific manufacturer and product model, but usually follows JEDEC standards. Generally speaking, the size of the TSSOP-48 package is roughly within the following range:

Package length: usually between 10mm and 15mm.

Package width: usually between 6mm and 8mm.

Package thickness: usually between 1.0mm and 1.2mm.

The length and width of pins may also vary according to standards, but they are usually designed to be sturdy enough to withstand thermal and mechanical stresses during the welding process.

Application:

TSSOP-48 packaging is commonly used in high-performance microcontrollers, digital signal processors (DSPs), FPGAs (field programmable gate arrays), communication chips, memory modules (such as SDRAM), analog-to-digital converters (ADCs), digital to analog converters (DACs), and other applications that require medium to large numbers of I/O pins.

matters needing attention:

When designing and welding TSSOP-48 packaging, the following points need to be noted:

Pad design: PCB design needs to be based on the pad layout provided by the manufacturer to ensure correct soldering and alignment.

Welding process: The welding of TSSOP packaging requires precise temperature control and time management to avoid overheating or cold welding.

Thermal management: Although not the main consideration in TSSOP packaging, heat dissipation still needs to be considered in high-power applications.

When selecting TSSOP-48 packaging, reference should be made to the manufacturer's data manual and application notes for detailed dimensional information, recommended design guidelines, and welding process parameters. The TSSOP-48 package is very popular in modern electronic product design due to its multiple pins and compact size, especially in complex systems that require high integration.