TO-126 packaging is a type of packaging for power semiconductor devices, which is a low-cost, medium power packaging suitable for various electronic applications. The TO-126 packaging design is designed to handle low to medium power levels, providing basic heat dissipation and electrical performance. It is commonly used for through-hole installation (THD) and is widely used in various electronic devices due to its simple structure and low cost.

characteristic:

Low to medium power processing capability: The TO-126 package is designed to handle low to medium power levels and is suitable for power management, signal conditioning, and other applications that require lower currents.

Basic thermal performance: There is a metal pad at the bottom of the package that can be directly connected to the heat dissipation copper foil on the PCB or fixed to the heat sink by screws, helping to transfer heat from the internal semiconductor chip to the external environment.

Through hole installation: The TO-126 package is typically used for through hole installation, which allows the device to be fixed to the heat sink through the circuit board and screws, providing basic cooling options.

Cost effectiveness: Due to its simple structure and manufacturing process, TO-126 packaging is relatively inexpensive and suitable for cost sensitive applications.

Structure:

The TO-126 package usually consists of a plastic shell and an internal metal substrate, which comes into contact with the semiconductor chip and plays a role in heat dissipation. The top of the package may have additional metal sheets or other heat dissipation enhancement structures. Pins extend from one side of the package for electrical connections.

Size:

The size of TO-126 packaging may vary depending on the specific manufacturer and product model, but usually follows industry standards. Generally speaking, the size of the TO-126 package is roughly within the following range:

Package length: usually between 10.1mm and 10.9mm.

Package width: usually between 6.5mm and 7.1mm.

Package thickness: usually between 4.0mm and 4.6mm.

Application:

TO-126 packaging is commonly used in transistors, regulators, operational amplifiers, comparators, voltage references, and other power semiconductor devices. These devices are widely used in power supply, signal processing, consumer electronics, automotive electronics, industrial control, and other low to medium power electronic devices.

matters needing attention:

When designing and soldering TO-126 packaging, the following points need to be noted:

Pad design: PCB design needs to be based on the pad layout provided by the manufacturer to ensure correct soldering and alignment.

Welding process: The welding of TO-126 packaging requires precise temperature control and time management to avoid overheating or cold welding.

Thermal management: In low to medium power applications, heat dissipation issues must be considered and may require the use of cooling solutions such as heat planes, heat sinks, or fans.

When selecting TO-126 packaging, reference should be made to the manufacturer's data manual and application notes for detailed dimensional information, recommended design guidelines, and welding process parameters. The TO-126 package is very popular in low to medium power electronic product design due to its low to medium power processing capacity and cost-effectiveness.