QFN64 (Quad Flat No leads Package with 64 terminals) is an integrated circuit packaging form of Surface Mount Technology (SMT). The characteristic of QFN packaging is the absence of traditional leads, but the use of lead-free flat pins. This design makes the packaging more compact, helping to achieve higher circuit density and better electrical performance.

characteristic:

Low profile: QFN packaging typically has a very low profile, suitable for applications with height limitations.

Good thermal performance: The bottom center of QFN packaging usually has an exposed heat dissipation pad that can be directly connected to the thermal plane of the PCB, providing good thermal management.

Excellent electrical performance: Due to the close pin spacing and lack of external leads, QFN packaging has low parasitic inductance and capacitance, making it suitable for high-speed digital and radio frequency (RF) circuits.

Space saving: The compact design of QFN packaging saves valuable circuit board space, making it suitable for portable and space limited applications.

Easy to automate assembly: QFN packaging is suitable for high-speed surface mount technology and facilitates automated production lines.

Structure:

The structure of the QFN64 package mainly includes four pins on the sides and a bottom heat dissipation pad. There are 16 pins on each side, a total of 64 pins. The pitch between pins is usually 0.5mm or 0.4mm, which determines the density of the package and the difficulty of soldering.

Size:

The size of QFN64 packaging may vary depending on the specific manufacturer and product model, but usually follows JEDEC standards. Generally speaking, the size of QFN64 packaging is roughly within the following range:

Package length: usually between 7mm and 10mm.

Package width: usually similar in length, also between 7mm and 10mm.

Package thickness: usually between 0.9mm and 1.4mm.

The heat spreader at the bottom usually occupies a large portion of the entire bottom area of the package, and its size is close to the external dimensions of the package.

Application:

QFN64 packaging is commonly used in high-performance microprocessors, digital signal processors (DSPs), power management ICs, wireless communication modules, and other applications that require high density and good thermal management.

matters needing attention:

When designing and soldering QFN64 packages, the following points need to be noted:

Pad design: PCB design needs to be based on the pad layout provided by the manufacturer to ensure correct soldering and alignment.

Thermal management: The bottom heat dissipation pad needs to be connected to the thermal plane on the PCB to effectively dissipate heat.

Welding process: The welding of QFN packaging requires precise temperature control and time management to avoid overheating or cold welding.

When selecting QFN64 packaging, reference should be made to the manufacturer's data manual and application notes for detailed dimensional information, recommended design guidelines, and welding process parameters.