QFP-100 (Quad Flat Package with 100 pins) is a widely used surface mount technology (SMT) integrated circuit packaging form. The characteristic of QFP packaging is its four sided pins, which extend outward from the four sides of the package, forming a structure that is easy to automatically attach.
characteristic:
Multiple Pin Count: The QFP-100 package has 100 pins, making it suitable for integrated circuits that require a large number of input/output (I/O) pins, such as microprocessors, digital signal processors (DSPs), and other complex logic devices.
Small form factor: QFP packaging typically has a smaller form factor, making it suitable for applications with limited space.
Good electrical performance: Due to the close pin spacing and no external leads, the parasitic inductance and capacitance of QFP packaging are low, making it suitable for high-speed digital and radio frequency (RF) circuits.
Easy to automate assembly: QFP packaging is suitable for high-speed surface mount technology and facilitates automated production lines.
Structure:
The structure of the QFP-100 package includes a rectangular plastic shell surrounded by straight pins protruding outward. The pitch between pins is usually 0.5mm, 0.65mm, or 0.8mm, which determines the density of the package and the difficulty of soldering.
Size:
The size of QFP-100 packaging may vary depending on the specific manufacturer and product model, but usually follows JEDEC standards. Generally speaking, the size of QFP-100 packaging is roughly within the following range:
Package length: usually between 10mm and 20mm.
Package width: usually similar in length, also between 10mm and 20mm.
Packaging thickness: usually between 1mm and 2mm.
The length and width of pins may also vary according to standards, but they are usually designed to be sturdy enough to withstand thermal and mechanical stresses during the welding process.
Application:
QFP-100 packaging is commonly used in high-performance microprocessors, digital signal processors (DSPs), ASICs (Application Specific Integrated Circuits), FPGAs (Field Programmable Gate Arrays), communication chips, and other applications that require a large number of I/O pins.
matters needing attention:
When using QFP-100 packaging, the following points should be noted:
Pad design: PCB design needs to be based on the pad layout provided by the manufacturer to ensure correct soldering and alignment.
Welding process: The welding of QFP packaging requires precise temperature control and time management to avoid overheating or cold welding.
Thermal management: In high-power applications, heat dissipation issues need to be considered, and it may be necessary to design heat dissipation paths on PCBs or use heat sinks.
When selecting QFP-100 packaging, reference should be made to the manufacturer's data manual and application notes for detailed dimensional information, recommended design guidelines, and welding process parameters. With the development of SMT technology, QFP packaging remains the preferred choice for many applications, especially for integrated circuits that require medium to large numbers of I/O pins.
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