DO-15 packaging is a semiconductor packaging with axial leads, mainly used for medium power electronic components such as rectifier diodes and voltage regulator diodes. This type of packaging has been widely used in the electronics industry due to its reliability and suitability for medium power applications. DO-15 packaging is commonly used in circuits that require certain power processing capabilities, such as power supply, motor drives, and automotive electronics.

characteristic:

Medium power processing capability: The DO-15 package is designed to handle medium power levels and is suitable for applications such as rectification and voltage stabilization.

Axial lead: This type of packaging has axial leads, which extend parallel from both ends of the component, making it easy to manually or automatically assemble onto a printed circuit board.

Good thermal performance: DO-15 packaging usually has good heat dissipation characteristics, which helps to transfer heat out of the internal semiconductor chip.

Durability: The packaging structure is sturdy and can resist mechanical stress and environmental influences to a certain extent.

Structure:

DO-15 packaging is typically made of glass or ceramic materials and has two metal leads for electrical connections. The encapsulated body may contain one or more internal components, depending on the type of electronic component being encapsulated.

Size:

The size of the DO-15 package may vary depending on the specific manufacturer and product model, but usually follows industry standards. Generally speaking, the size of the DO-15 package is roughly within the following range:

Package length: usually between 6.1mm and 7.6mm.

Package diameter: usually between 2.5mm and 3.2mm.

Lead diameter: usually between 0.5mm and 0.8mm.

Application:

DO-15 packaging is commonly used in rectifier diodes, voltage regulator diodes, Schottky diodes, and other medium power semiconductor devices. These devices are widely used in power supply, motor control, automotive electronics, industrial control, and other fields that require medium power electronic devices.

matters needing attention:

When designing and soldering DO-15 packages, the following points need to be noted:

Pad design: PCB design needs to be based on the pad layout provided by the manufacturer to ensure correct soldering and alignment.

Welding process: The welding of DO-15 packaging requires precise temperature control and time management to avoid overheating or cold welding.

Thermal management: In medium power applications, heat dissipation issues must be considered and may require the use of cooling solutions such as heat planes, heat sinks, or fans.

When selecting DO-15 packaging, reference should be made to the manufacturer's data manual and application notes for detailed dimensional information, recommended design guidelines, and welding process parameters. The DO-15 package is very popular in the design of medium power electronic products due to its equal power processing capability and good heat dissipation performance.