LL41 packaging is a type of ultra small, axial lead semiconductor packaging mainly used for micro electronic components such as resistors, capacitors, diodes, and transistors. This type of packaging has been widely used in the electronics industry due to its compact size and cost-effectiveness, especially in space limited applications such as portable electronic devices and precision instruments.

characteristic:

Ultra small size: The LL41 package is designed to be very compact, suitable for applications with extremely limited space, such as miniature circuit boards and compact modules.

Axial lead: This type of packaging has axial leads, which extend parallel from both ends of the component, making it easy to manually or automatically assemble onto a printed circuit board.

Low cost: The manufacturing and assembly costs of LL41 packaging are relatively low, making it suitable for large-scale production and cost sensitive applications.

Universality: Despite its small size, the LL41 package can be used for various types of electronic components, including resistors, capacitors, diodes, and transistors.

Structure:

LL41 packaging is typically made of ceramic or plastic materials and has two slender metal leads for electrical connections. The encapsulated body may contain one or more internal components, depending on the type of electronic component being encapsulated.

Size:

The size of LL41 packaging may vary depending on the specific manufacturer and product model, but usually follows industry standards. Generally speaking, the size of the LL41 package is roughly within the following range:

Package length: usually between 1.6mm and 2.0mm.

Package diameter: usually between 0.8mm and 1.0mm.

Lead diameter: usually between 0.2mm and 0.3mm.

Application:

LL41 packaging is commonly used for resistors, capacitors, diodes, transistors, and other micro electronic components. These devices are widely used in power management, signal processing, consumer electronics, automotive electronics, industrial control, and other low-power electronic devices.

matters needing attention:

When designing and soldering LL41 packaging, the following points need to be noted:

Pad design: PCB design needs to be based on the pad layout provided by the manufacturer to ensure correct soldering and alignment.

Welding process: The welding of LL41 packaging requires precise temperature control and time management to avoid overheating or cold welding.

Assembly accuracy: Due to the very small size of the LL41 package, high-precision positioning and operation are required during the assembly process.

When selecting LL41 packaging, reference should be made to the manufacturer's data manual and application notes for detailed dimensional information, recommended design guidelines, and welding process parameters. LL41 packaging is very popular in the design of micro electronic products due to its ultra small size and low cost.