SOD-123 (Small Outline Diode, 123) is a common surface mount device (SMD) diode packaging type. This type of packaging is widely used in various electronic devices, especially in space limited applications, due to its compact size and moderate power processing capability.

characteristic:

Small size: The SOD-123 package is designed to be very compact, suitable for applications with limited space, such as portable electronic products and compact circuit boards.

Medium power processing capability: The SOD-123 package can handle medium levels of power, making it suitable for general small signal and rectification applications.

Surface Mount: This packaging is designed for Surface Mount Technology (SMT) and can be efficiently installed on printed circuit boards through automated production lines.

Good thermal performance: Despite its small size, SOD-123 packaging can still provide reasonable thermal performance, helping to transfer heat out of semiconductor devices.

Structure:

SOD-123 packaging typically consists of a plastic casing and two metal pins, which are used for electrical connections. There may be a mark at the top of the package to indicate the direction of the cathode or anode.

Size:

The size of SOD-123 packaging may vary depending on the specific manufacturer and product model, but usually follows industry standards. Generally speaking, the size of SOD-123 packaging is roughly within the following range:

Package length: usually between 2.7mm and 3.1mm.

Package width: usually between 1.6mm and 1.9mm.

Packaging thickness: usually between 1.1mm and 1.4mm.

Application:

SOD-123 packaging is commonly used in small signal diodes, rectifier diodes, Schottky diodes, voltage regulator diodes, and other low-power semiconductor devices. These devices are widely used in power management, signal processing, consumer electronics, automotive electronics, industrial control, and other low to medium power electronic devices.

matters needing attention:

When designing and soldering SOD-123 packaging, the following points need to be noted:

Pad design: PCB design needs to be based on the pad layout provided by the manufacturer to ensure correct soldering and alignment.

Welding process: The welding of SOD-123 packaging requires precise temperature control and time management to avoid overheating or cold welding.

Thermal management: In low to medium power applications, although the heat dissipation capacity of SOD-123 packaging is limited, it is sufficient to meet the requirements in most cases.

When selecting SOD-123 packaging, reference should be made to the manufacturer's data manual and application notes for detailed dimensional information, recommended design guidelines, and welding process parameters. The SOD-123 package is very popular in low to medium power electronic product designs due to its small size and moderate power processing capability.