TO-247
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TO-247

TO-247 packaging is a type of packaging for high-power semiconductor devices, also known as Super TO-247 or TO-247AC. It is a three pin package designed specifically for high-power applications, providing excellent heat dissipation and electrical performance. The TO-247 package was developed to meet the demand for extremely high power density and excellent heat dissipation performance, allowing devices to be directly installed on PCBs or cooled through heat sinks.

characteristic:

High power processing capability: The TO-247 package is designed to handle high power levels and is suitable for power management, motor drive, and other applications that require high current.

Excellent thermal performance: There is a large metal pad at the bottom of the package, which can be directly connected to the heat dissipation copper foil on the PCB or fixed to the heat sink by screws, helping to effectively transfer heat from the internal semiconductor chip to the external environment.

Through hole installation: The TO-247 package is commonly used for through hole installation, but there are also surface mount versions (such as TO-247-4L), which provide design flexibility.

Reliability: Due to its sturdy structure and excellent heat dissipation design, the TO-247 package has high reliability in high-power applications.

Structure:

The TO-247 package usually consists of a plastic shell and an internal metal substrate, which comes into contact with the semiconductor chip and plays a role in heat dissipation. The top of the package may have additional metal sheets or other heat dissipation enhancement structures. Pins extend from one side of the package for electrical connections.

Size:

The size of the TO-247 package may vary depending on the specific manufacturer and product model, but usually follows industry standards. Generally speaking, the size of the TO-247 package is roughly within the following range:

Package length: usually between 15.5mm and 16.5mm.

Package width: usually between 10.0mm and 10.5mm.

Packaging thickness: usually between 4.5mm and 5.5mm.

Application:

TO-247 packaging is commonly used in MOSFETs, IGBTs, Schottky diodes, fast recovery diodes, and other high-power semiconductor devices. These devices are widely used in power supply, DC-DC converters, motor control, automotive electronics, industrial automation, and other high-power electronic devices.

matters needing attention:

When designing and soldering TO-247 packaging, the following points need to be noted:

Pad design: PCB design needs to be based on the pad layout provided by the manufacturer to ensure correct soldering and alignment.

Welding process: The welding of TO-247 packaging requires precise temperature control and time management to avoid overheating or cold welding.

Thermal management: In high-power applications, heat dissipation issues must be considered, which may require the use of cooling solutions such as heat planes, heat sinks, or fans.

When selecting TO-247 packaging, reference should be made to the manufacturer's data manual and application notes for detailed dimensional information, recommended design guidelines, and welding process parameters. The TO-247 package is very popular in high-power electronic product design due to its high power processing capability and excellent heat dissipation performance.

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