TO-252 packaging, also known as DPAK (Discrete Packaging), is a type of packaging for power semiconductor devices. It is a surface mount (SMD) package designed specifically for medium power applications. The TO-252 package was developed to meet the requirements of medium power density and good heat dissipation performance, allowing devices to be directly installed on PCBs without the need to pass through the circuit board like traditional through hole packaging.

characteristic:

Medium power processing capability: The TO-252 package is designed to handle medium power levels and is suitable for power management, motor drive, and other applications that require medium current.

Good thermal performance: There is a large metal pad at the bottom of the package that can be directly connected to the heat dissipation copper foil on the PCB, helping to effectively transfer heat from the internal semiconductor chip to the external environment.

Surface Mount: The TO-252 package is surface mount, which means it can be installed using standard SMT technology, improving production efficiency and circuit board density.

Reliability: Due to its sturdy structure and excellent heat dissipation design, the TO-252 package has high reliability in medium power applications.

Structure:

The TO-252 package usually consists of a plastic shell and an internal metal substrate, which comes into contact with the semiconductor chip and plays a role in heat dissipation. The top of the package may have additional metal sheets or other heat dissipation enhancement structures. Pins extend from one or both sides of the package for electrical connections.

Size:

The size of the TO-252 package may vary depending on the specific manufacturer and product model, but usually follows industry standards. Generally speaking, the size of the TO-252 package is roughly within the following range:

Package length: usually between 6.5mm and 9.9mm.

Package width: usually between 6.1mm and 6.5mm.

Package thickness: usually between 2.3mm and 2.8mm.

Application:

TO-252 packaging is commonly used in MOSFETs, IGBTs, Schottky diodes, fast recovery diodes, and other power semiconductor devices. These devices are widely used in power supply, DC-DC converters, motor control, consumer electronics, automotive electronics, industrial automation, and other medium power electronic devices.

matters needing attention:

When designing and soldering TO-252 packaging, the following points need to be noted:

Pad design: PCB design needs to be based on the pad layout provided by the manufacturer to ensure correct soldering and alignment.

Welding process: The welding of TO-252 packaging requires precise temperature control and time management to avoid overheating or cold welding.

Thermal management: In medium power applications, heat dissipation issues must be considered and may require the use of cooling solutions such as heat planes, heat sinks, or fans.

When selecting TO-252 packaging, reference should be made to the manufacturer's data manual and application notes for detailed dimensional information, recommended design guidelines, and welding process parameters. The TO-252 package is very popular in the design of medium power electronic products due to its equal power processing ability and good heat dissipation performance.