TO-263 (also known as D2PAK) is a type of packaging for power semiconductor devices, which is a surface mount (SMD) packaging designed specifically for high-power applications. The TO-263 package was developed to meet the demand for higher power density and better heat dissipation performance. It allows devices to be directly installed on PCBs without the need to pass through the circuit board like traditional through hole packaging.

characteristic:

High power processing capability: The TO-263 package is designed to handle higher power levels and is suitable for power management, motor drive, and other applications that require higher currents.

Excellent thermal performance: There is a large metal pad at the bottom of the package that can be directly connected to the heat dissipation copper foil on the PCB, helping to effectively transfer heat from the internal semiconductor chip to the external environment.

Surface Mount: The TO-263 package is surface mount, which means it can be installed using standard SMT technology, improving production efficiency and circuit board density.

Reliability: Due to its sturdy structure and excellent heat dissipation design, the TO-263 package has high reliability in high-temperature and high-power applications.

Structure:

The TO-263 package usually consists of a plastic shell and an internal metal substrate, which comes into contact with the semiconductor chip and plays a role in heat dissipation. The top of the package may have additional metal sheets or other heat dissipation enhancement structures. Pins extend from one or both sides of the package for electrical connections.

Size:

The size of the TO-263 package may vary depending on the specific manufacturer and product model, but usually follows industry standards. Generally speaking, the size of the TO-263 package is roughly within the following range:

Package length: usually between 9.9mm and 10.7mm.

Package width: usually between 10.1mm and 10.7mm.

Package thickness: usually between 4.5mm and 5.1mm.

Application:

TO-263 packaging is commonly used in MOSFETs, IGBTs, Schottky diodes, fast recovery diodes, and other power semiconductor devices. These devices are widely used in power supply, DC-DC converters, motor control, automotive electronics, industrial automation, and other high-power electronic devices.

matters needing attention:

When designing and soldering the TO-263 package, the following points need to be noted:

Pad design: PCB design needs to be based on the pad layout provided by the manufacturer to ensure correct soldering and alignment.

Welding process: The welding of TO-263 packaging requires precise temperature control and time management to avoid overheating or cold welding.

Thermal management: In high-power applications, heat dissipation issues must be considered, which may require the use of cooling solutions such as heat planes, heat sinks, or fans.

When selecting the TO-263 package, reference should be made to the manufacturer's data manual and application notes for detailed dimensional information, recommended design guidelines, and welding process parameters. The TO-263 package is very popular in high-power electronic product design due to its high power processing capability and good heat dissipation performance.